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Technology

Besi orders more than double as AI and hybrid bonding tech drive demand

July 23 (Reuters) - BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year's level, fuelled by strong demand for AI, hybrid bonding, photonics and data ...

Source: RSS · July 23, 2026 at 5:41 PM · AI-assisted report

Besi orders more than double as AI and hybrid bonding tech drive demand

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KUALA LUMPUR, 24 JULY 2026 —

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Headline: Besi orders more than double as AI and hybrid bonding tech drive demand Lead: July 23 (Reuters) - BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year's level, fuelled by strong demand for AI, hybrid bonding, photonics and data ... Body: July 23 (Reuters) - BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year's level, fuelled by strong demand for AI, hybrid bonding, photonics and data ... Source: RSS Published: 2026-07-23T06:15:00.000Z Region: Asia Topic: Technology (AI-assisted rewrite, based on the original source)

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